By Topic

Simulation aided design of a two-phase thermosyphon for power electronics cooling

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Agostini, F. ; Corp. Res., ABB Switzerland Ltd., Baden-Dättwil, Switzerland ; Gradinger, T. ; de Falco, Carlo

In this paper we present a novel system for power electronics cooling consisting of a thermosyphon loop composed of an evaporator, to which the power modules are attached, and of a condenser, formed by a set of vertically mounted aluminum panels. To facilitate the optimization of the design of the condenser, which is critical for the whole system performance, we developed a simulation tool based on a multiscale mathematical model valid in the natural convection regime. The mathematical model and the numerical method adopted to solve it have been validated by comparing the simulation results with experimental measurements.

Published in:

IECON 2011 - 37th Annual Conference on IEEE Industrial Electronics Society

Date of Conference:

7-10 Nov. 2011