By Topic

Investigations of adhesion between Cu and Benzocyclobutene (BCB) polymer dielectric for 3D integration applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Huang, W.C. ; Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan ; Ko, C.T. ; Hu, S.H. ; Leu, J.
more authors

In this paper, the adhesion strength between Cu metal and Benzocyclobutene (BCB) polymer dielectric was investigated and reported. The relation between the adhesion strength and thickness of metal layer and the relation between the adhesion strength and stacking order of copper and BCB polymer layer are discussed as well. Finally, the concept of an extra layer between Cu metal and BCB polymer layer to improve the adhesion strength was evaluated. The results of this research can provide important guidelines of hybrid bonding and underfill for 3D integration applications.

Published in:

Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International

Date of Conference:

19-21 Oct. 2011