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High power electronics package: From modeling to implementation

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6 Author(s)
Yuan, C. ; Netherlands Organ. for Appl. Sci. Res. (TNO), Eindhoven, Netherlands ; Kregting, R. ; Huaiyu Ye ; van Driel, W.
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Power electronics, such as high power RF components and high power LEDs, requires the combination of robust and reliable package structures, materials, and processes to guarantee their functional performance and lifetime. We started with the thermal and thermal-mechanical modeling of such component performances. With robust validation. Afterwards, an online testing method, design rules, and new structures/modifications have been implemented to improve the performance and reliability of high power electronics. This paper reviews our efforts on the RF transistors and high power LED's developments.

Published in:

Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International

Date of Conference:

19-21 Oct. 2011