By Topic

Affect of Anneal Temperature on All-Copper Flip-Chip Connections Formed via Electroless Copper Deposition

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Hyo-Chol Koo ; Chem. & Biomol. Eng., Georgia Inst. of Technol., Atlanta, GA, USA ; Lightsey, C. ; Kohl, Paul A.

A fabrication technique for bonding discrete copper surfaces using electroless deposition has been developed in order to form all-copper flip-chip interconnects. The electroless copper fillet which bonds the two copper surfaces would replace solder as the electrical and mechanical connection mechanism at the first-level of packaging. An organic-additive free electroless bath was used to bond adjacent copper surfaces. The effect of anneal temperature on the electroless bond was analyzed. The electroless bond strength was shown to increase as a function of anneal temperature through the elimination of entrapped hydrogen and recrystallization of the copper. The seam between the intimately mated copper surfaces was removed at temperatures as low as 100°C.

Published in:

Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:2 ,  Issue: 1 )