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Nano copper conductive ink for RFID application

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4 Author(s)
Jian Li ; Sch. of Mater. Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China ; Bing An ; Jian Qin ; Yiping Wu

A novel nano copper conductive ink, composed of anti-oxidation nano copper particles and chemical additives, had been successfully developed and employed for RFID application. A pattern of UHF RFID antenna was chosen to print on polyimide (PI) film by ink-jet printing, and then cured by UV light to form the copper wire. The adhesion of the nano copper ink film on PI was checked by cross cut tape test, and the results showed 100% film remained. As the RFID antennas and RF chips were packaged by anisotropic conductive adhesive to form the RFID inlays, the reading distance of the inlays can reach 3 meters. This proved that nano copper conductive ink had a potential for RFID application.

Published in:

Advanced Packaging Materials (APM), 2011 International Symposium on

Date of Conference:

25-28 Oct. 2011