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Failure analysis of LEDs

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3 Author(s)
Lu Guoguang ; Applic. of Electron. Component Lab., Sci. & Technol. on Reliability Phys, Guangzhou, China ; Yang Shaohua ; Lei Zhifeng

Light-emitting diodes (LEDS) are a strong candidate for the nest-generation general illumination applications. The reliability of LEDs is the key point for its applications, and the main challenges facing the development of high reliable LED is packaging process. In this paper, the overview of state of the art techniques in LED failure analysis is provided, and the main failure modes such as bonding defects, die attaching defects and other defects that caused by poor package process are investigated through some failure analysis cases.

Published in:

Advanced Packaging Materials (APM), 2011 International Symposium on

Date of Conference:

25-28 Oct. 2011