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Processing technology of embedded thin-film resistor materials

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5 Author(s)

It is relatively rare for us to research Embedded Thin-Film Resistor (ETFR) Materials in domestic. This paper describes the development history and present situation of the ETFR, the whole process technology is told, the urgency of domestic products is revealed, the thermal stability and microscopic characteristics of the Ni-Cr (80/20 wt.%) ETFR material that we have researched are introduced, the possible development and application is also tentatively discussed.

Published in:

Advanced Packaging Materials (APM), 2011 International Symposium on

Date of Conference:

25-28 Oct. 2011