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In this Letter, we described a solution-processed indium-gallium-zinc oxide thin-film transistors (TFTs) with a solution-processed aluminum oxide phosphate gate dielectric, fabricated at a maximum annealing temperature under 350 °C to be applicable to conventional fabrication process of flat-panel displays (FPDs). The solution-processed TFTs exhibited competitive device characteristics under 350 °C, including a field-effect mobility of 4.50 cm2/Vs, an on-to-off current ratio of ∼109, a threshold voltage of 2.34 V, and a subthreshold gate swing of 0.46 V/dec, making them applicable to the future backplane of FPDs.