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Compressive imaging applied to infrared-based semiconductor failure analysis

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3 Author(s)
Ting Sun ; ECE Dept., Rice Univ., Houston, TX, USA ; Woods, G. ; Kelly, K.F.

We present IR emission images obtained from semiconductor devices using compressive sensing mathematics combined with a single-element infrared photon detector as method of defect detection. High signal to noise ratio, robust measurements and fast acquisition have make compressive imaging a strong supplement to traditional IR analysis systems.

Published in:

Infrared, Millimeter and Terahertz Waves (IRMMW-THz), 2011 36th International Conference on

Date of Conference:

2-7 Oct. 2011