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Antenna-in-package solution for millimeter-wave applications implemented in a microwave-compatible multilayer PCB technology

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4 Author(s)
Enayati, A. ; RFCDM Group, IMEC, Leuven, Belgium ; Deraedt, W. ; Vandenbosch, G.A.E. ; Raisanen, A.V.

A multi-layer PCB technology is used to implement an antenna-in-package solution for millimeter-wave-frequency applications. The antenna is a 1×2 array of dipoles fed by a vialess balun structure. The measurement and simulation results are compared for return loss and radiation pattern characteristics.

Published in:
Microwave Integrated Circuits Conference (EuMIC), 2011 European

Date of Conference: 10-11 Oct. 2011

Page(s):
600 - 603
Print ISBN:
978-1-61284-236-3
INSPEC Accession Number:
12437298
Conference Location :
Manchester
Product Type:
Conference Publications

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