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Design of Antenna-on-Chip, Antenna-on-Package and detectors from RF, microwave to THz frequency range in SiGe-C technology

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5 Author(s)
Wane, S. ; NXP-Semicond., Esplanade Anton Philips, Colombelles Caen, France ; Bardy, S. ; van Heijster, R. ; Goulet, F.
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Design solutions for on-chip signal detectors, Antenna-on-Chip and Antenna-on-Package (with Bond Wire elements), from RF, Microwave to THz frequency range, using state-of-the-art SiGe BiCMOS technology are presented. Both CML and CMOS detectors are designed, fabricated and compared in terms of their performances such as conversion gain and robustness against process variations. Zero mask adder Schottky diodes with low leakage current, low junction capacitance, large breakdown voltage and with cut-off frequencies in the THz range are demonstrated for detection, mixing and down-conversion.

Published in:

Microwave Integrated Circuits Conference (EuMIC), 2011 European

Date of Conference:

10-11 Oct. 2011