By Topic

Influence of thermal aging on the reliability of electrically conductive adhesives

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Seba Barto ; Department of Electrotechnology, Czech Technical University in Prague, Faculty of Electrical Engineering, Prague, Czech Republic ; Jakub Cinert ; Pavel Mach

Quality of electrically conductive adhesives is a main component in electronic packaging. It highly influences the total quality of a product containing such a component. With time and usage, adhesives lose some of the qualities. In some cases, changes in the molecule structure for example, can be responsible for this influence on material characteristics. This process is known as aging. It can badly affect the total electrical conductivity of adhesives and non-linearity, even mechanical properties of adhesive joints can be affected. In research field, aging is applied to test the expected reactions of the most important material parameters of electrically conductive adhesives. It also helps identifying the total operating life of the tested components. This work focuses primarily on analyzing the effect of thermal aging on the resistance of three types of adhesives, one of these adhesives is a two-component type, and the other two are one-component type.

Published in:

Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th International Symposium for

Date of Conference:

20-23 Oct. 2011