Cart (Loading....) | Create Account
Close category search window

Modeling of thermal via heat transfer performance for power electronics cooling

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Negrea, C. ; Interior Instrum. Human-Machine Driver Interface, Continental Automotive, Timisoara, Romania ; Svasta, P.

For power electronics and Light Emitting Diode (LED) lighting applications, thermal management represents a critical factor having important consequences on electrical performance and overall cost of the assembly. Although advanced solutions for heat removal like Isolated Metal Substrates (IMS) base materials or thermally conductive epoxies have entered the market for a few years they still have a high price tag and add significant manufacturing costs to the finished assembly. Obtaining a good thermal management by using conventional materials and manufacturing techniques is often a key design challenge that engineers have to overcome. By creating thermal paths from one layer to another, the equivalent cooling area for an electronic component can be significantly increased thus lowering the junction-to-ambient thermal resistance which is the main indicator of cooling performance. These thermal paths between layers are commonly defined as through-hole plated vias connected to copper areas. Our paper presents a study of the thermal performances of through-hole thermal vias used for heat transfer between layers on printed circuit boards. Different geometries and scenarios are investigated by simulation using Computational Fluid Dynamics (CFD) software in order to determine steady state thermal behavior.

Published in:

Design and Technology in Electronic Packaging (SIITME), 2011 IEEE 17th International Symposium for

Date of Conference:

20-23 Oct. 2011

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.