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Distributed multi TSV 3D clock distribution network in TSV-based 3D IC

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8 Author(s)
Dayoung Kim ; Dept. of Electr. Eng., KAIST, Daejeon, South Korea ; Joohee Kim ; Jonghyun Cho ; Jun So Pak
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As TSV-based three-dimensional integrated circuit (3D IC) technology advances rapidly, research on a new scheme for a three-dimensional clock distribution network (3D CDN) in TSV-based 3D IC with low skew, low jitter, low power consumption and small area consumption is needed. In this paper, we propose a new 3D CDN structure with distributed multi-TSV 3D CDN (DMT 3D CDN), and analyze the skew, jitter, power and area consumption. The proposed DMT 3D CDN improves the performance of the skew, jitter and area consumption, although the power consumption is degraded.

Published in:

Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011 IEEE 20th Conference on

Date of Conference:

23-26 Oct. 2011