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The combination of a top-down and a bottom-up fabrication approach will be a key technology to overcome the minimum size limit of the top-down approach. Gentle cold welding is a promising method to connect nano objects without appreciable damages to the nano device in a bottom-up approach. We developed the gentle cold welding method using the combination of an electrical field and an atomic rearrangement. The formulated process was visualized between gold tips using a transmission electron microscope. The initial connection mechanism was divided into three modes depending on a bias voltage between tips; (1) physical contact, (2) atom extraction, and (3) field evaporation, depending on the electrical fields. All the nano connections grew by the atomic rearrangement driven by gold surface self-diffusion. The grown connections were single crystalline structures. These results suggested that this welding will be a useful method to build up future nano devices and systems.