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Electro-thermal circuit simulation using simulator coupling

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4 Author(s)
Wunsche, S. ; Fraunhofer Inst. of Integrated Circuits, Dresden, Germany ; Clauss, C. ; Schwarz, P. ; Winkler, F.

The paper presents a methodology for simulating the static and dynamic performance of integrated circuits in the presence of electro-thermal interactions on the integrated circuit die. The technique is based on the coupling of a finite element method (FEM) program with a circuit simulator. In contrast to other known simulator couplings a time step algorithm is used, Its implementation in simulation tools is described. The thermal modeling of the die/package structure and the extended modeling of the electronic circuit is discussed. Simulation results which indicate the capabilities of the methodology for electro-thermal simulation are compared to experimental results.

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Very Large Scale Integration (VLSI) Systems, IEEE Transactions on  (Volume:5 ,  Issue: 3 )