Cart (Loading....) | Create Account
Close category search window
 

Improving conduction and mechanical reliability of woven metal interconnects

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Bhattacharya, R. ; Dept. of Lighting & Cleantech Incubator, Inst. of Philips Res., Eindhoven, Netherlands ; van Pieterson, L. ; van Os, K.

We present a simple fabrication process that produces reliable electronic textile backplanes. We electroplate copper onto woven conductive yarns in order to improve the yarn's conductivity as well as the reliability of electrical contact points between the conductive warp and weft yarns. This process improves the electrical performance of the woven yarns and of the warp/weft contacts by a factor of 1.22 and 3.63, respectively. Also, in mechanical tests, the electroplated textiles show improved electrical performance when subjected to mechanical strain. Furthermore, we use this process to mount electronic submounts onto the textile substrate on top of which electronic components could be easily connected, thereby creating an electronic textile backplane.

Published in:

Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:2 ,  Issue: 1 )

Date of Publication:

Jan. 2012

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.