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On-Chip Two-Phase Cooling With Refrigerant 85 \mu{\rm m} -Wide Multi-Microchannel Evaporator Under Hot-Spot Conditions

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4 Author(s)
Costa-Patry, E. ; Heat & Mass Transfer Lab., Ecole Polytech. Fed. de Lausanne, Lausanne, Switzerland ; Nebuloni, S. ; Olivier, J. ; Thome, J.R.

Hot-spots are present in micro-electronics and are challenging to cool effectively. This paper presents highly nonuniform heat flux measurements obtained for a pseudo-CPU with 35 local heaters and temperature sensors cooled by a silicon multi-microchannel evaporator with 85 μm wide and 560 μm high channels separated by 46 μm wide fins. A low pressure dielectric refrigerant, R245fa, was used as evaporating test fluid. The base heat flux was varied from 6 to 160 W/cm2 and the junction temperature always remained below 65°C, while the fluid inlet saturation temperature was 30.5°C. On-chip two-phase cooling was found to very effectively cool the hot-spots without inducing flow instabilities. Building on analogous uniform heat flux tests made on the same test section, the effects of position, orientation size, and strength of the hot-spots were analyzed.

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Components, Packaging and Manufacturing Technology, IEEE Transactions on  (Volume:2 ,  Issue: 2 )