By Topic

Three-dimensional optoelectronic architectures for massively parallel processing systems

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
H. Van Marck ; Dept. of Electron. & Inf. Syst., Ghent Univ., Belgium ; J. Van Campenhout

Advances in optical interconnection technology create the potential of constructing three-dimensional systems. This has a profound impact on the performance of the designs implemented in such a way. Using the average interconnection length and the interconnection length distribution as performance measures, we will show that three-dimensional architectures are much more suitable for the implementation of massively parallel processing systems than traditional two-dimensional architectures. For optoelectronic three-dimensional architectures, we have to take into account the physical and geometric differences between optical and electrical channels. The main consequences of these differences on system performance will be discussed.

Published in:

Massively Parallel Processing Using Optical Interconnections, 1997., Proceedings of the Fourth International Conference on

Date of Conference:

22-24 June 1997