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Ultra-high density packaging technology for injectable medical devices

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6 Author(s)
Bryan L. McLaughlin ; Charles Stark Draper Laboratory, Cambridge MA 02139 ; Brian Smith ; John Lachapelle ; Dan Traviglia
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Future implantable medical devices will be highly miniaturized and almost certainly leverage die-level electronics miniaturization and packaging. Here, an integrated ultra-high density packaging platform is proposed to enable a new class of medical devices. Dense modules are obtained by interconnecting existing ASICs and discrete components using a process which achieves the highest packaging densities available.

Published in:

2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society

Date of Conference:

Aug. 30 2011-Sept. 3 2011