Skip to Main Content
This paper proposes a general applicable numerical algorithm for the optimization of the layer thickness distribution using the insulating shields during the electroplating process in an electrochemical reactor. The aim of this method is to develop a systematic modification of the insulating shield position in order to get a more uniform distribution of the current density and layer thickness at the cathode. The strong feature is that it does not need the re-meshing of the computational domain when the insulating shield changes the position. The interface of the insulating shield is implicitly calculated solving a convection equation over a number of predefined time steps proportional with and in the direction of a well chosen rate provided by a genetic algorithm. Finally an example related to the optimization layer thickness distribution in the vicinity of a singularity (incident angle between the electrode and insulator = 180°), using an insulating shield will be presented.