Close category search window
 

Modeling of Crosstalk Effects in Multiwall Carbon Nanotube Interconnects

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Feng Liang ; Sch. of Electron. Inf., Wuhan Univ., Wuhan, China ; Gaofeng Wang ; Hai Lin

Crosstalk effects in multiwall carbon nanotube (MWCNT) interconnects for future ICs are investigated by virtue of the equivalent single conductor model and the finite-difference time-domain solution of transmission line equations. The worst case time delay and the peak crosstalk voltage on victim wire of multiwire MWCNT interconnect configurations are derived and compared to those of the copper (Cu) wire counterparts for the intermediate and global interconnects at the 22- and 14-nm technology nodes. The numerical results illustrate that the crosstalk-induced time delays in the MWCNT interconnects are much smaller than those in the Cu interconnects, in particular, for longer wires. Nevertheless, the MWCNT interconnects exhibit little improvement on the crosstalk-induced noises in comparison with their Cu counterparts.

Published in:
Electromagnetic Compatibility, IEEE Transactions on  (Volume:54 ,  Issue: 1 )

Date of Publication: Feb. 2012

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.