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The BOOM Project: Towards 160 Gb/s Packet Switching Using SOI Photonic Integrated Circuits and Hybrid Integrated Optical Flip-Flops

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11 Author(s)
Stamatiadis, C. ; Photonics Commun. Res. Lab., Nat. Tech. Univ. of Athens, Athens, Greece ; Gomez-Agis, F. ; Stampoulidis, L. ; Vyrsokinos, K.
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We present a 160 Gb/s optical packet switching architecture that performs label detection and packet wavelength con- version using photonic components integrated on silicon-on-insulator (SOI) waveguide boards. For label detection, we report the fabrication of a 4-channel tunable, second-order microring resonator demultiplexer using the SOI nanowire waveguide platform. For all-optical wavelength conversion we report the integration and packaging of a cascaded SOI delay interferometer (DI) structure using SOI rib waveguides. Both components were assembled with an optical flip-flop to enable 160 Gb/s optical packet switching. The power penalty after the wavelength conversion process was ~4.5 dB with error performance well above the FEC limit. This work is part of the European ICT-BOOM project which aims at building a Tb/s photonic router using hybrid and heterogeneous integration on SOI substrates. The preliminary results reported here is the initial step before the final project demonstrator.

Published in:

Lightwave Technology, Journal of  (Volume:30 ,  Issue: 1 )

Date of Publication:

Jan.1, 2012

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