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Damage of Interconnects by Electromigration Induced Surface Evolution

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2 Author(s)
Zhijun, Zhao ; Department of Engineering Mechanics, Tsinghua University, Beijing 100084 ; Wei, Yang

Under intensive electric current, exposed aluminum interconnects undergo surface evolution driven by electromigration. The evolution of the surface morphology induces fluctuations in electric field. When the surface diffusivity is inhomogeneous, surface damage appears under electric current as a combination of stationary solution and transients. The experimental observations confirm the above theoretical predictions and raise the reliability issue of electromigration in polycrystalline interconnects.

Published in:

Tsinghua Science and Technology  (Volume:2 ,  Issue: 2 )

Date of Publication:

June 1997

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