By Topic

3D Multipath planning for UAV based on network graph

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $33
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Xin Liu ; Institute for Pattern Recognition and Artificial Intelligence, Key Laboratory of National Defense Science and Technology for Multi-spectral Information Processing Technologies, Huazhong University of Science and Technology, Wuhan 430074, P. R. China ; Chengping Zhou ; Mingyue Ding

According to the characteristic and the requirement of multipath planning, a new multipath planning method is proposed based on network. This method includes two steps: the construction of network and multipath searching. The construction of network proceeds in three phases: the skeleton extraction of the configuration space, the judgment of the cross points in the skeleton and how to link the cross points to form a network. Multipath searching makes use of the network and iterative penalty method (I PM) to plan multi-paths, and adjusts the planar paths to satisfy the requirement of maneuverability of unmanned aerial vehicle (UAV). In addition, a new height planning method is proposed to deal with the height planning of 3D route. The proposed algorithm can find multiple paths automatically according to distribution of terrain and threat areas with high efficiency. The height planning can make 3D route following the terrain. The simulation experiment illustrates the feasibility of the proposed method.

Published in:

Journal of Systems Engineering and Electronics  (Volume:22 ,  Issue: 4 )