Referenced Items are not available for this document.
The paper presents the design and test of a 32×32 CMOS 3D-image sensor, based-on indirect time-of-flight (ToF) technique with its derived algorithm: MDSI (multiple double short time integration). The design key feature is the implementation, in pixel-level, of analog signal processing; namely: correlated double sampling (CDS) and analog averaging. Which leads to a significant enhancement in term of signal-to-noise ratio (SNR), while keeping reasonable fill-factor and power consumption. The chip has been fabricated using 0.6um standard CMOS process. The overall achieved performances exhibit an interesting trade-off.
Published in:
Semiconductor Conference Dresden (SCD), 2011
Date of Conference: 27-28 Sept. 2011
- Page(s):
- 1 - 4
- Print ISBN:
- 978-1-4577-0431-4
- INSPEC Accession Number:
- 12344847
- Conference Location :
- Dresden
- Digital Object Identifier :
- 10.1109/SCD.2011.6068755
- Product Type:
- Conference Publications
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
