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Heavy Ion Characterization and Monte Carlo Simulation on 32 nm CMOS Bulk Technology

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5 Author(s)
Uznanski, S. ; Technol. R D, Central CAD & Design Solutions, Crolles, France ; Gasiot, G. ; Roche, P. ; Autran, J.
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Heavy ion experimental test results carried out on static random-access memories (SRAMs) manufactured in bulk complementary metal-oxide semiconductor (CMOS) 32 nm are compared to Monte Carlo simulations. Additional simulation capabilities allow for insight in heavy ion cross-section variations as a function of temperature, power supply voltage, and process corners. Monte Carlo simulations of a radiation-hardened-by-design flip-flop based on a dual-interlocked storage cell latch have been performed and show similar sensitivities for 65 nm and 32 nm technologies. Finally, for the first time, the heavy-ion cross-section of the 20 nm bulk CMOS SRAMs is anticipated by simulation by using the latest available technology data.

Published in:
Nuclear Science, IEEE Transactions on  (Volume:58 ,  Issue: 6 )

Date of Publication: Dec. 2011

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