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Fabrication and in-situ evaluation of copper TSV interconnection

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6 Author(s)
Shenglin Ma ; Nat. Key Lab. on Micro/Nano Fabrication Technol., Peking Univ., Beijing, China ; Yunhui Zhu ; Xin Sun ; Min Miao
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In this paper, a process for making copper Though-Silicon-Via (TSV) interconnection is developed. In order to improve the yield of the process, challenging issues in the process is discussed and typical failures in the TSV interconnection are summarized. A measuring scheme is proposed to monitor these failures in the process and simulation is performed to testify the feasibility of the method.

Published in:

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Date of Conference:

8-11 Aug. 2011