Cart (Loading....) | Create Account
Close category search window
 

Halogen-free and reworkable corner bond adhesive for array-based packages and the impact on board-level solder joint reliability

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Hongbin Shi ; Grad. Sch. of Inf., Production & Syst., Waseda Univ., Kitakyushu, Japan ; Ueda, T.

Capillary flow and no-flow underfill were demonstrated to yield dramatic reliability improvement in the mechanical shock and torsion of most array-base package (ABP) assemblies in portable electronic devices. However, it is very difficult to rework the defective ABPs after the underfill operation. Unfortunately, reworkability of the packages with underfill is needed for printed circuit board assemblies (PCBAs) with ABPs failing either during final test or in the field. Corner bond adhesive (CB A) applying an adhesive only near the corner of an ABP and curing. This adhesive forms a mechanical bridge between the ABP and the PCB, since much less adhesive is used compared to underfill, the area of adhesive in contact with the board and the package is smaller. This should aid in the ability to develop systems that are reworkable without damaging the PCB. In addition, with the improving of life quality and increasing of environmental protection thought, people's demand for environmentally friendly halogen-free products has become more and more pressing. This investigation provides initial results of an ongoing study aimed at thermo-mechanical reliability of the ABP assemblies with halogen-free and reworkable CBA in portable electronic devices. One halogen-free and reworkable CBA was evaluated in order to get the detail reliability performance for ABP assemblies. Material properties such as coefficient of thermal expansion (CTE), glass transition temperature (Tg), modulus, apparent strengths of adhesion (ASA), etc were obtained. Shear, bend, drop and thermal cycling tests have been conducted with this material. A comparative study of the performance of ABPs with one halogen reworkable CBA materials and no-bonded materials are reported. Results of the above tests shows that the halogen-free CBA has the equivalent or even better performance compared with the halogen CBA.

Note: As originally published the article file displayed corrupted images. A corrected PDF supplied by the authors now replaces the original.  

Published in:

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Date of Conference:

8-11 Aug. 2011

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.