Cart (Loading....) | Create Account
Close category search window
 

Investigation on microstructures and properties of low Ag content lead-free solder alloy

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Guoqiang Wei ; Sch. of Mech. & Automotive Eng., South China Univ. of Technol., Guangzhou, China ; Zhonghua Wan ; Mingyang Xue ; Lei Wang

The microstructure, the wettability and dissolution behavior of Sn0.8Ag0.5Cu2.0Bi0.05Ni (SACBN) and Sn3.0Ag0.5Cu (SAC305) lead-free solder alloys were comparatively investigated. The results show that the microstructure of SACBN solder alloy contains β-Sn and eutectic phase, and that the eutectic phase is made of β-Sn, well-ditributed needlelike Ag3Sn, granular (Cu, Ni)6Sn5 and minor granular Bi. The max wetting force of SACBN was higher, and the wetting time was shorter than SAC305 while the wetting angle is bigger and the spreading area is smaller under same temperature. The dissolution quantity of Cu substrate linearly increases with increasing immersion time in the two solder alloys. The dissolution rate of SACBN solder alloy is lower than SAC305 at 250°Cand 275°C, and is higher at 300°C.

Published in:

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Date of Conference:

8-11 Aug. 2011

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.