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Electrical characterization of cylindrical and annular TSV for combined application thereof

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7 Author(s)
Xin Sun ; Institute of Microelectronics, Peking University, Beijing, 100871, P. R. China ; Qinghu Cui ; Yunhui Zhu ; Zhiyuan Zhu
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In this paper, the potential application of combining cylindrical TSV and annular TSV into 3D integration was studied. First, the schematic fabrication process of cylindrical and annular TSV was proposed. Lumped equivalent circuit model of these different kinds of TSV structures from the physical configuration were studied and verified. Besides, 3D full wave electromagnetic (EM) simulations of cylindrical TSVs and annular TSVs were performed to verify the proposed lumped model of TSV.

Published in:

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Date of Conference:

8-11 Aug. 2011