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Design and fabrication of a TSV interposer for SRAM integration

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11 Author(s)
Yunhui Zhu ; Nat. Key Lab. of Sci. & Technol. on Micro/Nano Fabrication, Peking Univ., Beijing, China ; Shenglin Ma ; Qinghu Cui ; Wenping Kang
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TSV interposer provides a cost efficient solution way for 3D IC integration. In this paper, a TSV interposer technology is proposed for SRAM stacking. A simple fabrication process is developed for cost-sensitive application. The mushroomlike Cu/Sn bumps by copper overburden can be directly connected with other substrate, which eliminates a CMP planarization to improve the yield and reduce fabrication cost. The electrical and thermal-mechanical behaviors of the 3D system were analyzed. Preliminary fabrication results are demonstrated. The TSV interposer technology is promising for 3D SRAM integration.

Published in:

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Date of Conference:

8-11 Aug. 2011