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Challenges in 3D integration due to differences in silicon and system design environments

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5 Author(s)
Yip, T.G. ; Rambus Inc., Sunnyvale, CA, USA ; Lau, B. ; Seeker, D. ; Louis-Chandran, J.
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Interests in advancing 3D design and integration have stimulated this study of connecting two different silicon dies using an organic interposer. This paper reports some of the challenges encountered by the system and silicon designers during the process of 3D integration. The discussion focuses on ways to improve the efficiency of the design flow, integration and verification of a 3D configuration. By considering the strength and weakness of the silicon and system design environments, the two were used in a complementary manner to achieve the 3D integrated design.

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Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on

Date of Conference:

8-11 Aug. 2011