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TFSOI technology for portable wireless communication systems

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6 Author(s)
W. M. Huang ; Commun. Products Lab., Motorola Inc., Mesa, AZ, USA ; Y. C. Tseng ; D. Monk ; D. Diaz
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Recent growth in the portable wireless communication market has driven semiconductor technologies toward voltage and power reduction. The reduced junction capacitance and near-ideal MOS device characteristics of SOI provides an inherent advantage for low-voltage low-power applications. Substantial progress in applying SOI technology for these applications has been demonstrated in recent years. The quest for a single chip system has also initiated work in developing high frequency and analog SOI circuits. In this paper, the application of Thin-Film-Silicon-On-Insulator (TFSOI) technology for wireless communication systems is reviewed and future development discussed

Published in:

Custom Integrated Circuits Conference, 1997., Proceedings of the IEEE 1997

Date of Conference:

5-8 May 1997