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Thermal and optical simulation of high-power LED array based on silicon heatsink

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2 Author(s)
Dongmei Zhong ; Coll. of Optoelectron. Eng., Univ. of Posts & Telecommun. CQUPT, Chongqing, China ; Jing Zhang

A silicon heat sink with grooved mirror was fabricated by micro-processing technology, then a 5W blue 2×2 LED array with Silicon-based heat sink was accomplished by way of studying its heat conduction. Firstly, the optical ray trace simulation of the array was carried out to study the relationship between light profile and lens shaped, groove height. Then according to the optical simulation results, a proper package structure was designed, and the 3D model of a 2 × 2 LED array with Silicon-based heat sink was established by Solidworks. Thermal simulation was carried out to obtain the temperature distribution of the LED array. At last, based on the optical and thermal analysis, the LED device was fabricated and its output power, optical efficiency, junction temperature and thermal resistance were measured. The junction temperature was nearly the same as the simulation value.

Published in:

Electronics, Communications and Control (ICECC), 2011 International Conference on

Date of Conference:

9-11 Sept. 2011

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