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Optical interconnects integrated with lasers, silicon optical modulators and germanium photodetectors on a single silicon substrate were demonstrated for the first time. A 5 Gbps line bit rate and 3.5 Tbps/cm2 transmission density were achieved.
Published in:
Optical Communication (ECOC), 2011 37th European Conference and Exhibition on
Date of Conference: 18-22 Sept. 2011
- Page(s):
- 1 - 3
- ISSN :
- Pending
- Print ISBN:
- 978-1-4577-1918-9
- INSPEC Accession Number:
- 12346085
- Conference Location :
- Geneva
- Product Type:
- Conference Publications
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