By Topic

A study of the thermal characteristics of a conductive adhesive chip attach process

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
S. Sathe ; Microelectron. Div., IBM Corp., Endicott, NY, USA ; B. Sammakia ; R. Kodnani ; M. Gaynes

Electrically conductive adhesives (ECAs) have been proposed as an alternative to solder in the surface mount (SMT) and flip chip attach (FCA) applications. This paper describes the development of a transient heat transfer model of a chip bonding process using the ECA bumps. The chip is heated using a top thermode directly contacting the chip and the card is heated from the back side (Z=0) using a heater. A detailed three-dimensional heat transfer model to account for the conduction, heat storage and convection and radiation from the card is developed using the finite volume technique. The spatial and temporal temperature distributions are studied through initial ramp-up, dwell and cool-down processes. It is seen that the bump temperatures are dominated and controlled by the heating process near the chip as opposed to heating the back side of the card. The numerical model is verified via actual measurements and the agreement is within 15 percent

Published in:

Electronic Components and Technology Conference, 1997. Proceedings., 47th

Date of Conference:

18-21 May 1997