By Topic

Development of fluxless flip chip bonding to a thin film multichip module substrate

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

7 Author(s)
R. Bonda ; Motorola Inc., Tempe, AZ, USA ; T. Fang ; B. Hileman ; D. Spigler
more authors

Motorola SPS has developed an assembly process for a three-chip multichip module using a fluxless bonding technique. The substrate is a 25 mm×25 mm glass that containing two layers of electroplated metallization with vias connecting the two layers and dielectric layer separating them. A test substrate is designed to characterize the continuity and leakage of the assembled modules. One of the chips has two staggered rows of 384 total bumps on the periphery with 80 μm pitch and 45 μm bump size. The other two chips have three staggered rows, 222 bumps on each chip, 210 μm pitch and 100 μm bump size. The bump composition is Pb-Sn with low Sn content. All three chips are bonded to the substrate using a fluxless plasma process followed by reflow in a nitrogen furnace. A high precision robot is used for placement and tacking of the chips on the substrate. After the bonding, the chips are underfilled with a proprietary underfill epoxy, and tested for reliability. All the reliability criteria for the specific application of this module have been met. Physical design and assembly process of this multichip module will be presented

Published in:

Electronic Components and Technology Conference, 1997. Proceedings., 47th

Date of Conference:

18-21 May 1997