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Chip scale packaging using chip-on-flex technology

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4 Author(s)
Fillion, R. ; Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA ; Burdick, B. ; Shaddock, D. ; Piacente, P.

An increasing number of electronic designers, fabricators and users see Chip Scale Packaging (CSP) as a way to obtain the benefits foreseen in multichip packaging and Chip-on-Board (COB) without the problems and limitations currently associated with each. The Chip-on-Flex (COF) multichip packaging technology has been demonstrated to be applicable to single chip packages that meet chip scale packaging goals. This paper looks at the Chip-on-Flex Chip Scale technology and addresses issues including the process, structure, assembly, yields and reliability

Published in:

Electronic Components and Technology Conference, 1997. Proceedings., 47th

Date of Conference:

18-21 May 1997