By Topic

Distance learning paradigms in electronics packaging: a national course on thermal design of electronic products

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Joshi, Y. ; CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA ; Bar-Cohen, A. ; Bhavnani, S.

Electronics packaging education requires a multidisciplinary approach, integrating concepts in electrical engineering, materials, structural analysis, heat transfer, reliability and computational methods. The availability of advanced instructional technologies is allowing an unprecedented opportunity to incorporate several desirable attributes to courseware development in such areas. This paper describes an ongoing multi-university effort undertaken to develop a national course on thermal design of electronic products. The participating institutions provide a combination of faculty with expertise in various aspects of thermal design. Examples of course materials developed so far include: (i) videotaped lecture segments on specialized topics, (ii) case studies, and (iii) multi-media computational design simulations. At each institution, the modules are integrated with traditional classroom lectures. These materials will form a central online resource base, accessible through the world wide web (WWW). In addition to their possible use in courses dealing specifically with electronics cooling, it is anticipated that instructors of more comprehensive packaging courses, as well as more general heat transfer and thermal design courses, will find it possible to incorporate these modules in their syllabi and thus dramatically expand the number of engineering students exposed to these critical issues

Published in:

Electronic Components and Technology Conference, 1997. Proceedings., 47th

Date of Conference:

18-21 May 1997