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High density optical interconnects for board and backplane applications using VCSELs and polymer waveguides

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16 Author(s)
Liu, Y.S. ; Gen. Electr. Corp. Res. & Dev. Center, Schenectady, NY, USA ; Wojnarowski, R.J. ; Hennessy, W.A. ; Rowlette, J.
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This paper describes the technical approach and progresses of the POINT (Polymer Optical Interconnect Technology) program. This project is a collaborative effort among GE, Honeywell, AMP, AlliedSignal, Columbia University and University of California at San Diego (UCSD), sponsored by DARPA/ETO to develop affordable optoelectronic packaging and interconnect technologies for board and backplane applications. In this paper, we describe the recent development under this program in the following areas: (a) a high density optical interconnect for board and backplane applications using polymer waveguides (Polyguide) to demonstrate high I/O density (100 μm channel spacing) and high speed (~1 Gbps) interconnect with an interconnect distance to 280 mm, (b) a high density and high speed VCSEL array packaging technology that employs planar and batch fabrication processes scaleable to large volume, low-cost manufacturing, (c) passive alignment techniques for reducing the recurrent cost in an optoelectronic assembly, (d) low-loss optical polymers for board and backplane level interconnects, and (e) CAD tools for modeling multimode guided wave systems and assisting optoelectronic packaging mechanical design

Published in:

Electronic Components and Technology Conference, 1997. Proceedings., 47th

Date of Conference:

18-21 May 1997