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122 GHz antenna-integration in a plastic package based on a flip chip interconnect

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2 Author(s)
Beer, S. ; Inst. fuer Hochfrequenztech. und Elektron., Karlsruhe Inst. of Technol., Karlsruhe, Germany ; Zwick, T.

The paper introduces a packaging concept for the integration of a 122 GHz MMIC and a separate off-chip antenna into a plastic QFN package. The concept is explained and the advantages compared to previous concepts are given. As the concept incorporates a 122 GHz chip to antenna interconnect based on flip chip technology, measurements and simulations of such an interconnect are presented to evaluate the performance. Finally, a possible antenna design is presented together with the measurement results of this antenna.

Published in:

Microwave Workshop Series on Millimeter Wave Integration Technologies (IMWS), 2011 IEEE MTT-S International

Date of Conference:

15-16 Sept. 2011