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Eutectic solder flip chip technology-bumping and assembly process development for CSP/BGA

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8 Author(s)
H. Aoki ; Semicond. Manuf. Eng. Center, Toshiba Corp., Yokohama, Japan ; C. Takubo ; T. Nakazawa ; S. Honma
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Eutectic solder flip chip fabrication technology, through bumping to assembly process, has been developed. In bumping process, electroplating method and thick photo resist process could form eutectic solder bumps whose uniformity of height are less than 10% within wafer. Eutectic solder flip chip assembly process, which includes bonding, cleaning and underfilling, has been also developed. Bonding process of eutectic solder indicates good self-alignment. The excellent rosin cleaning was achieved by the ultrasonic cleaning process with Techno Care. In underfilling process, the underfill resin which can be applied to small stand-off have been chosen. Reliability tests for CSP and flip chip interconnection were carried out and confirmed the good reliability of fabrication process using eutectic solder flip chip technology

Published in:

Electronic Components and Technology Conference, 1997. Proceedings., 47th

Date of Conference:

18-21 May 1997