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Transient Thermal Performance of IGBT Power Modules Attached by Low-Temperature Sintered Nanosilver

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7 Author(s)
Gang Chen ; Sch. of Chem. Eng. & Technol., Tianjin Univ., Tianjin, China ; Dan Han ; Yun-Hui Mei ; Xiao Cao
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Recently, to accurately study the transient thermal behavior of power modules, a transient thermal measurement system was developed to investigate the transient thermal behavior of insulated-gate bipolar transistor (IGBT) modules attached by nanosilver paste and two kinds of lead-free solders. We found that the transient thermal impedance of IGBT modules attached by nanosilver paste was 9% lower than that of the modules using SAC305 and SN100C with 40-ms heating pulse. In addition, finite-element analysis is employed to simulate thermal performance of the IGBT devices. The simulation shows that the transient thermal impedance of IGBT modules attached by nanosilver paste was also lower than that of the modules using lead-free solders. A convenient way was introduced to well predict the transient thermal behavior of IGBT power module. The calculated results agreed well with the measured one. The interface thermal impedance of sintered nanosilver and SNC100C are calculated to be 0.011 ~ 0.031 K/W and 0.022 ~ 0.042 K/W, respectively.

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Device and Materials Reliability, IEEE Transactions on  (Volume:12 ,  Issue: 1 )