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In this paper, we review the recent optimization work in hybrid silicon microring lasers. Device structure and fabrication procedures are discussed first, followed by two major improvements in carrier injection and thermal management. A simple, well-controlled quantum well undercut leads to about 20% enhancement of injection efficiency. A silicon-on-diamond (SOD) substrate is demonstrated to fundamentally solve the device heating issue for silicon-on-insulator (SOI)-based active devices. SOD rib waveguides show low propagation loss of 0.74 dB/cm, which is 0.2 dB/cm higher than SOI counterparts. More than 22× reduction of device heating in hybrid silicon microring lasers is projected by simulations.