Cart (Loading....) | Create Account
Close category search window
 

Assembly and interconnection technologies for MID based on thermally conductive plastics for heat dissipation

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
Hoerber, J. ; Inst. for Manuf. Autom. & Production Syst., Univ. of Erlangen-Nuremberg, Erlangen, Germany ; Mueller, M. ; Franke, J. ; Ranft, F.
more authors

The present study aims to display new opportunities for Molded Interconnect Devices by using thermally conductive thermoplastics as substrate materials. Therefore, a polyamide 66 polymer was modified with aluminum oxide and gains thermal conductivity above 2 W/m·K. This compound was employed for three dimensional circuit carriers with integrated cooling fins manufactured by means of injection molding. Hot embossing tests indicate that it is possible to metallize the highly filled polymers at sufficient adhesion. For mounting and interconnecting electronic components by reflow soldering in a forced convection reflow soldering oven, a homogeneous temperature distribution, due to the thermal conductivity, enables enhanced process windows. Using test specimens with mounted LEDs, results of current research work are presented dealing with evaluating thermal footprints. The aim is to optimize manufacturing as well as component cooling.

Published in:

Electronics Technology (ISSE), 2011 34th International Spring Seminar on

Date of Conference:

11-15 May 2011

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.