By Topic

Signal and power integrity analysis of TSV-Based 3D IC

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

9 Author(s)
Jun So Pak ; Dept. of EE, KAIST, Daejeon, South Korea ; Heegon Kim ; Jonghyun Cho ; Joohee Kim
more authors

In the paper, an analytical TSV model based on the MIS (Metal-Insulator-Silicon) structure analysis, TSV's electrical performances and their frequency- and time-domain analysis in viewpoint of transmission line, and on-chip PDN impedance analysis depending on on-chip PDN design including TSV arrangements and stacking configurations of 3D IC are addressed.

Published in:

Electromagnetics in Advanced Applications (ICEAA), 2011 International Conference on

Date of Conference:

12-16 Sept. 2011