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Advanced thermal analysis of packaged electronic systems using computational fluid dynamics techniques

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1 Author(s)
M. Reynell ; Flomerics, Kingston-upon-Thames, UK

Most electronic system failures are due to thermal overstressing, and the major current trends in electronics design are adding to the thermal problem. This article introduces a new class of electronics thermal analysis tool, which uses computational fluid dynamics (CFD) techniques to predict the three-dimensional air movement and associated heat-transfer processes in electronics enclosures.<>

Published in:

Computer-Aided Engineering Journal  (Volume:7 ,  Issue: 4 )