By Topic

Automated pavement distress data collection and analysis: a 3-D approach

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
L. Bursanescu ; GIE Technol., Montreal, Que., Canada ; F. Blais

This paper describes a 3-D automated pavement distress data collection and analysis system based on NRC's Biris sensor technology. The paper introduces the problem to be solved, the selected design criteria, and the adopted solution to monitor the quality of road surfaces. The system geometry for the acquisition of the three-dimensional coordinates of pavement surface distresses is presented. Multiple feature extraction and system integration concepts are given with emphasis placed on the real-time processing of the raw data by a parallel array of processors. Advantages and disadvantages of this technology are discussed. System performances and experimental results are provided

Published in:

3-D Digital Imaging and Modeling, 1997. Proceedings., International Conference on Recent Advances in

Date of Conference:

12-15 May 1997