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Multiple-chip package embedded on compound board for light emitting diode

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4 Author(s)
Long, X. ; Dept. of Phys., Chongqing Normal Univ., Chongqing, China ; Liao, R. ; Zhou, J. ; Zeng, Z.

A simple and efficient packaging technique with aluminium-core printed circuit board component embedded copper reflectors is presented for fabricating high-power white light emitting diode (LED) arrays. Three-dimensional finite element simulation and dynamic infrared imaging for analysis of the packaged nine-chips LED array are carried out to investigate the thermal and optical properties. The results show the method, which obtained a luminous efficiency of 126 lm/W and thermal resistance of 3.4 K/W, is suitable for high efficiency and low-cost LED based solid-state lighting.

Published in:

Electronics Letters  (Volume:47 ,  Issue: 20 )